In microelectronic packaging, as the size of the solder connection becomes smaller, the current density increased continuously, which generates great joule heat, and the temperature of components is raised.As a result, the solder joints are subject to the combined action of both electric field and thermal field, leading to the failure of the solder joint.This paper analyzes the failure of CSP sample, and the cross-sectional micro-structural transformation of Sn-3.8Ag-0.7Cu solder joints in different service situations, under 1.0 A electric current at room temperature and low temperature.There are three stages in the failure behavior of solder interconnects.The paper observes the growth of Cu6Sn5 compounds of PCB side interface and the degradation of Cu of chip side interface in the solder joint, and draws the conclusion that the failure of the solder interconnects was suppressed by decreasing the temperature of the solder joints.
ZHENG Kai, LIU Chun-zhong, LIU Zhi-quan
. Degradation mechanisms of chip scale package solder interconnects by electrical loading[J]. Journal of Shenyang Aerospace University, 2013
, 30(5)
: 54
-59
.
DOI: 10.3969/j.issn.2095-1248.2013.05.012
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