Degradation mechanisms of chip scale package solder interconnects by electrical loading

Degradation mechanisms of chip scale package solder interconnects by electrical loading

ZHENG Kai, LIU Chun-zhong, LIU Zhi-quan

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Journal of Shenyang Aerospace University ›› 2013, Vol. 30 ›› Issue (5) : 54-59. DOI: 10.3969/j.issn.2095-1248.2013.05.012

Materials Engineering

Degradation mechanisms of chip scale package solder interconnects by electrical loading

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2013, 30(5): 54-59 https://doi.org/10.3969/j.issn.2095-1248.2013.05.012

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