芯片级封装互连体在电流作用下的损伤行为
郑凯, 刘春忠, 刘志权
Degradation mechanisms of chip scale package solder interconnects by electrical loading
ZHENG Kai, LIU Chun-zhong, LIU Zhi-quan
沈阳航空航天大学学报 . 2013, (5): 54 -59 .  DOI: 10.3969/j.issn.2095-1248.2013.05.012