以Al/Cd液/液偶为研究对象, 研究了在700 ℃下电流对Al/Cd液/液偶界面熔合及凝固组织的影响。研究结果表明, 未施加电流时凝固后界面附近铝基体中有颗粒状镉析出, 镉基体中有颗粒状铝析出。随着保温时间的延长, 界面附近铝基体和镉基体上析出颗粒状组织的量增加, 颗粒尺寸增大。施加电流促进了Al/Cd液/液界面区域的熔合, 凝固后界面附近铝基体中析出颗粒状镉的尺寸和镉基体中析出颗粒状铝的尺寸与未施加电流相比较都有明显的增加。并且这些颗粒状组织的尺寸随着电流的增加而增大。
The paper investigated the effect of electric current on the interfacial fusion and the solidified microstructure of Al/Cd liquid-liquid couple at 700 ℃.The experimental results showed that some Cd particles precipitated in the Al base and some Al particles precipitated in the Cd base near the solidified interface of Al/Cd couple with no applied electric current.The amount of precipitated particles in Al base and Cd base near the solidified interface and the size of the precipitated particles increased with the holding time of Al/Cd couple at 700 ℃.Applied current in Al/Cd liquid-liquid couple promoted the interface fusion.The size of the precipitated Cd particles in Al base and the size of the precipitated Al particles in Cd base near the solidified interface of Al/Cd couple with applied current are obviously larger than those without applied current.The size of the mentioned precipitated particles increased with the applied electric current flow.
[1]Uenishi K, Kawaguchi H, Kobayashi K F.Microstructure of mechanically alloyed Al-In alloys[J].Journal of Materials Science, 1994, 29(18):4860-4865.
[2]刘源, 郭景杰, 贾均.偏晶合金液-液相分离机制和均质偏晶合金的制造方法[J].铸造, 2000, 49(1):11-16.
[3]刘彬, 刘静.铜互连电迁移失效的研究与进展[J].微电子器件与技术, 2007, 4:211-215.
[4]Misra A K.Effect of electric potentials on solidification of near eutectic Pb-Sb-Sn alloy [J].Mater.Lettersr, 1986, 4(3):176-177.
[5]Shih-ming Kuo, Kwang-lung Lin.Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich[J].Journal of Electronic Mater, 2008, 37(10):1611-1617.
[6]J F.Zhao C Unuvar.Kinetics of current-enhanced dissolution of nickel in liquid aluminum[J].Acta Materialia, 2007, 55:5592-5600.
[7]Chi-ming Chen, Sinn-wen Chen.Electric current effects on Sn/Ag interfacial reactions[J].Journal of Electronic Materials, 1999, 28(7):902-906.
[8]Misra A K.A novel solidification technique of metals and alloys - under the influence of applied potential[J].Metall.Trans.A, 1985, 16(7):1354-1355.
[9]Ahmed S, McKannan E C.Control of r′morphologyin nickel base superalloys through alloy design and densification processing under electric field[J].Materials Science and Technology, 1994, 10 (11), 941-946.
[10]顾根大, 徐雁允, 李阁英, 等.电场作用下Sn-5%Bi合金的胞晶生长[J].机械工程学报, 1991, 27(5):37-41.
